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Capabilities
  1. Paste printing test/Printer & Paste Inspection
  2. Reflow test/ Component placer & Reflow Oven (N2)
  3. Micro-Structure & Analysis for solder joint, etc./SEM & EPMA, X-ray Inspection
  4. Impurity & Alloy Analysis for Sn-Pb & Pb-Free solder
  5. Melting point & TG Analysis/DSC, TG-DTA
  6. A training program for SMT engineers
  7. Development of paste solder
 
Equipment
  • Paste Printer
  • Solder-Paste Printing Laser Inspection
  • Mounter(0201, QFP, CSP, BGA)
  • SMIC N2 Reflow Oven SX-II
  • Cleaning Machine (H2O)
  • Scanning Electron Microscope w/EPMA
  • X-Ray Inspection (for VOID, CSP-Bump)
  • Metal Analyzer (Solder composition & Impurity)
  • Differential Scanning Calorimeter
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