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| 1. Senju Metal
has been sub-licensed agreement by the following patents: |
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Sn-Ag-Cu(JP3027441:Patented
by SMIC, USP5527628)
Sn-Ag-Cu-Bi(USP4879096, CAP1299471)
Sn-Bi-Ag(Au)(USP5320272)
Sn-Ag-Cu-Ni(USP4758407)
Sn-Ag-Cu-Sb(JP3027441:Patented by SMIC, USP5405577,JP2752258)
Sn-Ag-Alpha-inter-metallic compound (USP5520752) |
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| 2. Sn/Ag/Cu Patent and worldwide Senju group,
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Sn-Ag-Cu(JP3027441:Patented
by SMIC, USP5527628)
Sn-Ag-Cu-Bi(USP4879096, CAP1299471)
Sn-Bi-Ag(Au)(USP5320272)
Sn-Ag-Cu-Ni(USP4758407)
Sn-Ag-Cu-Sb(JP3027441:Patented by SMIC, USP5405577,JP2752258)
Sn-Ag-Alpha-inter-metallic compound (USP5520752) |
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| Overseas Affiliates |
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Europe
/Senju Manufacturing (Europe) Ltd.
America /Senju Comtek Corp.
Malaysia /Senju (Malaysia) SDN. BHD.
Philippines /Senju Solder (Phils) Inc.
China /Senju Solnet Metal Co., Ltd.
Beijing Senju Electronic Materials Co., Ltd. |
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Copyright© 2007 Senju Comtek Corp., All
rights reserved |
