|
CX-85
Clean reflow
furnace for solder bump formation on W-CSP and FCB / flip-chip
bonding
This clean reflow furnace is designed for high-precision
application
like information technology and mobile telecommunication
devices as well as for bare-mounting applications. It excels
at face-up packaging by wire bonding and face-down mounting
by FCB combining a state-of-the-art heating system with
a high quality walking beam conveyor. These components enable
high-quality solder bump formation at the wafer level.
|
