No-clean Solder Paste Water Soluble Solder Paste Alloy type for Solder Paste Alloy Type Composition Melting Temperature(C) Remarks 63 63Sn-Pb 183 Standard Material 2062 62Sn-Pb-2Ag 178 - 192   AT 62Sn-Pb-0.4Ag 178 - 185 Prevent Tombstone High Heat Fatigue Patented by Senju 7030 Sn-Pb-3Bi-2Ag 170 - 189     Powder for Solder Paste Powder Type Type in IPC-SPEC. Particle size Remarks 50 Type 2 53 - 10 um 25mils pitch 42 Type 3 45 - 25 um 20mils pitch 32 Type 4 36 - 25 um 16mils pitch 21 Type 5 25 - 15 um 12mils pitch 10 Type 6 15 - 5 um Wafer bumping   Flux type for Solder Paste Flux Type Series No. Feature Remarks 200 No-Clean , High reliability Superior Printability 700 Low Residue Nitrogen 400 Multi Dispenser 300 High Solderability 500 Water Soluble   Copyright© 2007 Senju Comtek Corp., All rights reserved