Sparkle Balls are
very small spheres of high-purity solder for micro soldering
system. The most important advantages of solder balls
are their very clean surfaces and exact solder quantity
control. Solder balls are packed in argon gas for delivery
to the user. A wide range of solder types including
low and high temperature alloys can be produced as Sparkle
Ball.
Uses:
SMIC Sparkle Ball
Conductor
bumps on hybrid ICs, power transistors, soldering
miniature parts such as crystal resonators and diodes.
Most suitable for Ball Grid Array, Multi Chip Module,
Chip On Board, Flip Chip and CSP.
Typification
Form
Diameter (mm)
Features
S type
0.1
0.2
0.3 to 3.0
Diameter diviation
is within ±10µm (under 0.3ø)
Balls larger than 1.1mm dia. are slightly
oval, and controlled by weight.
C type
Cu
ball
0.3 to 0.5
Thickness of solder
5 to 100µm
Solder Plated,
copper-core balls.
Diameter deviation is within ±20µm.
Ag-cored balls are available.
Pure metal
ball
0.1 above
Sn, Pb balls
Silver balls are available on your request.
